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Update API document for TPC#1621

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kawakami-masaki0 merged 1 commit intoSonySemiconductorSolutions:feature_tpc_improvementfrom
kawakami-masaki0:feature_update_tpc_api_document
Jan 6, 2026
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Update API document for TPC#1621
kawakami-masaki0 merged 1 commit intoSonySemiconductorSolutions:feature_tpc_improvementfrom
kawakami-masaki0:feature_update_tpc_api_document

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@kawakami-masaki0 kawakami-masaki0 commented Jan 6, 2026

Pull Request Description:

  • Update API document for get_target_platform_capabilities and get_target_platform_capabilities_sdsp.
  • These files need to check
    • model_compression_toolkit/__init__.py
    • docs/api/api_docs/index.html
    • docs/api/api_docs/modules/target_platform_capabilities.html
    • docs/api/api_docs/methods/get_target_platform_capabilities.html
    • docs/api/api_docs/methods/get_target_platform_capabilities_sdsp.html

Note: The CICD link error will be fixed in a separate PR.
   Another CICD errors occured because MCTWrapper verification repair is not yet supported.

Checklist before requesting a review:

  • I set the appropriate labels on the pull request.
  • I have added/updated the release note draft (if necessary).
  • I have updated the documentation to reflect my changes (if necessary).
  • All function and files are well documented.
  • All function and classes have type hints.
  • There is a licenses in all file.
  • The function and variable names are informative.
  • I have checked for code duplications.
  • I have added new unittest (if necessary).

@kawakami-masaki0 kawakami-masaki0 merged commit a1a6220 into SonySemiconductorSolutions:feature_tpc_improvement Jan 6, 2026
11 of 37 checks passed
@kawakami-masaki0 kawakami-masaki0 deleted the feature_update_tpc_api_document branch January 6, 2026 06:28
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2 participants